Integrated Chip–Package–System Simulation
نویسنده
چکیده
Opportunities are wide open, all across the board. Smart technologies enable countless new applications, driving a range of end-use market sectors and boosting semiconductor sales. The number of networked devices is growing exponentially and globally. R&D teams rapidly pair devices with services, applications and content. At the same time, private companies — not just government agencies or military services — are playing a larger role in developing cutting-edge technology and products.
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